Due to the high temperature resistance, elongation and corrosion resistance of tantalum materials, semiconductor spinning crucibles made of tantalum plates are also called tantalum crucibles. Tantalum crucibles are mainly used as thermal insulation containers for semiconductor manufacturing equipment. Thermal insulation and energy concentration make the evaporation process more stable and the evaporation effect more uniform.
Our Semiconductor Spun Tantalum Crucible is a high-quality crucible designed specifically for the demanding processes in semiconductor manufacturing, including thin-film deposition, sputtering, and evaporation coating. Made from high-purity tantalum (Ta≥99.99%), these crucibles offer exceptional resistance to high temperatures, corrosion, and wear, ensuring optimal performance in advanced semiconductor and thin-film applications. Manufactured using the spun method, they provide uniform thickness, enhanced mechanical properties, and high precision for critical semiconductor processes.
Key Features
✔ High-Temperature Resistance – Capable of withstanding temperatures up to 3000°C, ideal for high-temperature semiconductor processes.
✔ Excellent Corrosion Resistance – Tantalum's inherent resistance to corrosion in reactive environments makes it perfect for use in vacuum deposition and sputtering.
✔ Superior Mechanical Strength – High tensile strength and durability ensure long service life, even under the stress of high thermal cycling.
✔ High Purity (≥99.99% Ta) – Minimizes contamination and ensures high-quality results in semiconductor production.
✔ Spun Manufacturing Process – Precision-machined to provide uniform thickness and enhanced mechanical properties, ensuring consistent performance.
Applications
🔹 Semiconductor Manufacturing – Ideal for use in chemical vapor deposition (CVD), physical vapor deposition (PVD), and sputtering processes for semiconductor wafers.
🔹 Thin-Film Deposition – Crucial for the production of thin-film materials in solar cells, microelectronics, and optical coatings.
🔹 Sputtering Targets – Suitable for tantalum sputtering targets used in microchip production and circuit fabrication.
🔹 Research & Development – Perfect for laboratories and R&D environments where high purity and precision are critical for experimental processes.
Available Specifications
Material: 99.99% Pure Tantalum
Diameter: Φ10mm – Φ600mm (customizable)
Height: ≤600mm
Wall Thickness: 0.5mm – 5mm
Surface Finish: Polished, Machined, or Alkaline Cleaned
Manufacturing process:
Tantalum plate--cutting--annealing--spinning--finishing--cleaning--testing--packaging
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